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A literature review of smart warehouse operations management

Frontiers of Engineering Management 2022, Volume 9, Issue 1,   Pages 31-55 doi: 10.1007/s42524-021-0178-9

Abstract: management based on the characteristics of smart warehouses, including the perspectives of information interconnection

Keywords： smart warehouse     operations management     interconnection     automation     integration     sustainability    

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Optimal Su-Do-Ku based interconnection scheme for increased power output from PV array under partial

P. SRINIVASA RAO,P. DINESH,G. SARAVANA ILANGO,C. NAGAMANI

Frontiers in Energy 2015, Volume 9, Issue 2,   Pages 199-210 doi: 10.1007/s11708-015-0350-1

Abstract: Partial shading is a common phenomenon in PV arrays. They drastically reduce the power output because of mismatch losses, which are reliant on the shape of the shade as well as the locations of shaded panels in the array. The power output can be improved by distributing the shade over various rows to maximize the current entering the node. A Su-Do-Ku configuration can be used to rearrange the physical locations of the PV modules in a total cross tied PV array with the electrical connections left unchanged. However, this arrangement increases the length of the wire required to interconnect the panels thus increasing the line losses. In this paper, an improved Su-Do-Ku arrangement that reduces the length of the wire required for the connection is proposed. The system is designed and simulated in a Matlab/Simulink environment for various shading patterns and the efficacies of various arrangements are compared. The results prove that the power output is higher in the proposed improved Su-Do-Ku reconfiguration technique compared to the earlier proposed Su-Do-Ku technique.

Keywords： array configuration     mismatch losses     partial shading     line losses     Su-Do-Ku arrangement    

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Agent-Based Simulation for Interconnection-Scale Renewable Integration and Demand Response Studies Artical

David P. Chassin,Sahand Behboodi,Curran Crawford,Ned Djilali

Engineering 2015, Volume 1, Issue 4,   Pages 422-435 doi: 10.15302/J-ENG-2015109

Abstract: technical requirements, implementation, and validation methods for quasi-steady agent-based simulations of interconnection-scalepresented and placed in the same control and economic modeling framework as generation resources for interconnectionModel performance is examined with system parameters that are typical for an interconnection approximately

Keywords： interconnection studies     demand response     load control     renewable integration     agent-based simulation     electricity    

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Exploration of interconnected factory mode: Haier Jiaozhou Air Conditioner Interconnected Factory

Yunjie ZHOU

Frontiers of Engineering Management 2017, Volume 4, Issue 4,   Pages 500-503 doi: 10.15302/J-FEM-2017105

Keywords： interconnected factory mode     user-centered     mass customization     interconnection    

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Creation and integration mechanism of instrumentation flexible developing system

Xiaoli XU, Qiushuang LIU

Frontiers of Mechanical Engineering 2011, Volume 6, Issue 2,   Pages 235-240 doi: 10.1007/s11465-011-0122-5

Abstract: integration mechanism, perfects the integrated supporting environment and integrated system of the flexible interconnection

Keywords： modern instrumentation developing     flexible interconnection     flexible integration mechanism     rapid integration    

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Heterogeneous III-V silicon photonic integration: components and characterization Special Feature on Optoelectronic Devices and Inte

Shang-jian ZHANG, Yong LIU, Rong-guo LU, Bao SUN, Lian-shan YAN

Frontiers of Information Technology & Electronic Engineering 2019, Volume 20, Issue 4,   Pages 472-480 doi: 10.1631/FITEE.1800482

Abstract:

Heterogeneous III-V silicon (Si) photonic integration is considered one of the key methods for realizing power- and cost-effective optical interconnections, which are highly desired for future high-performance computers and datacenters. We review the recent progress in heterogeneous III-V/Si photonic integration, including transceiving devices and components. We also describe the progress in the on-wafer characterization of photonic integration circuits, especially on the heterogeneous III-V/Si platform.

Keywords： Heterogeneous photonic integration     Optical interconnection     On-wafer characterization    

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Ensuring Energy Security in China through International Energy Cooperation

Wang Jun, Cao Yang, Wang Yusheng, Rao Jianye

Strategic Study of CAE 2021, Volume 23, Issue 1,   Pages 118-123 doi: 10.15302/J-SSCAE-2021.01.019

Abstract: promoting the establishment of a diversified import and trade pattern for oil and gas, strengthen the interconnection

Keywords： international energy cooperation     energy security     oil and gas import     power grid interconnection     energy    

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On-chip optical interconnect using visible light Article

Wei CAI, Bing-cheng ZHU, Xu-min GAO, Yong-chao YANG, Jia-lei YUAN, Gui-xia ZHU, Yong-jin WANG, Peter GRÜNBERG

Frontiers of Information Technology & Electronic Engineering 2017, Volume 18, Issue 9,   Pages 1288-1294 doi: 10.1631/FITEE.1601720

Abstract: We propose and fabricate a monolithic optical interconnect ona GaN-on-silicon platform using a wafer-level technique. Because theInGaN/GaN multiple-quantum-well diodes (MQWDs) can achieve light emissionand detection simultaneously, the emitter and collector sharing identicalMQW structure are produced using the same process. Suspended waveguidesinterconnect the emitter with the collector to form in-plane lightcoupling. Monolithic optical interconnect chip integrates the emitter,waveguide, base, and collector into a multi-component system witha common base. Output states superposition and 1×2 in-planelight communication are experimentally demonstrated. The proposedmonolithic optical interconnect opens a promising way toward the diverseapplications from in-plane visible light communication to light-inducedartificial synaptic devices, intelligent display, on-chip imaging,and optical sensing.

Keywords： Homogeneous integration     Multiple-quantum-well diode     Visible light interconnection     Coexistence of light    

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Moving from exascale to zettascale computing: challenges and techniques None

Xiang-ke LIAO, Kai LU, Can-qun YANG, Jin-wen LI, Yuan YUAN, Ming-che LAI, Li-bo HUANG, Ping-jing LU, Jian-bin FANG, Jing REN, Jie SHEN

Frontiers of Information Technology & Electronic Engineering 2018, Volume 19, Issue 10,   Pages 1236-1244 doi: 10.1631/FITEE.1800494

Abstract:

High-performance computing (HPC) is essential for both traditional and emerging scientific fields, enabling scientific activities to make progress. With the development of high-performance computing, it is foreseeable that exascale computing will be put into practice around 2020. As Moore’s law approaches its limit, high-performance computing will face severe challenges when moving from exascale to zettascale, making the next 10 years after 2020 a vital period to develop key HPC techniques. In this study, we discuss the challenges of enabling zettascale computing with respect to both hardware and software. We then present a perspective of future HPC technology evolution and revolution, leading to our main recommendations in support of zettascale computing in the coming future.

Keywords： High-performance computing     Zettascale     Micro-architectures     Interconnection     Storage system     Manufacturing    

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Title Author Date Type Operation

A literature review of smart warehouse operations management

Journal Article

Optimal Su-Do-Ku based interconnection scheme for increased power output from PV array under partial

P. SRINIVASA RAO,P. DINESH,G. SARAVANA ILANGO,C. NAGAMANI

Journal Article

Agent-Based Simulation for Interconnection-Scale Renewable Integration and Demand Response Studies

David P. Chassin,Sahand Behboodi,Curran Crawford,Ned Djilali

Journal Article

Exploration of interconnected factory mode: Haier Jiaozhou Air Conditioner Interconnected Factory

Yunjie ZHOU

Journal Article

Creation and integration mechanism of instrumentation flexible developing system

Xiaoli XU, Qiushuang LIU

Journal Article

Heterogeneous III-V silicon photonic integration: components and characterization

Shang-jian ZHANG, Yong LIU, Rong-guo LU, Bao SUN, Lian-shan YAN

Journal Article

Ensuring Energy Security in China through International Energy Cooperation

Wang Jun, Cao Yang, Wang Yusheng, Rao Jianye

Journal Article

On-chip optical interconnect using visible light

Wei CAI, Bing-cheng ZHU, Xu-min GAO, Yong-chao YANG, Jia-lei YUAN, Gui-xia ZHU, Yong-jin WANG, Peter GRÜNBERG

Journal Article

Moving from exascale to zettascale computing: challenges and techniques

Xiang-ke LIAO, Kai LU, Can-qun YANG, Jin-wen LI, Yuan YUAN, Ming-che LAI, Li-bo HUANG, Ping-jing LU, Jian-bin FANG, Jing REN, Jie SHEN

Journal Article